On this page we present only a brief introductory description of PhotoMachining services illustrated by a few examples. You will find more details on the Applications and Materials pages.
The Laser Processing center at PhotoMachining features modern and
sophisticated equipment (including the lasers shown in the photo on the left) and expert operators. More information about laser sources used at PhotoMachining is available on the Lasers page.
Our experience in contract manufacturing and material processing covers several areas:
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Medical Device Manufacturing
- precision cutting of plastic films
- high precision orifices in angioplasty catheters
- high precision orifices in angioplasty balloons
- drilled orifices in injection molded disposables
- precision marking of glass or plastic slides or parts and other devices
- high volume production capabilities in a certified class 10,000 clean room
- customer oriented approach (from concept stage through development stage, and into production)
- FDA compliant documentation process
- R&D on new devices and manufacturing techniques
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Information
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Orifice in a plastic part 550 microns thick, 90 microns in diameter.
Fragment of an array of 1000 vias 75 microns in diameter in 15 microns thick plastic wall.
Laser marking:
Bar code on a catheter
(Click on any picture
to zoom in)
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Microelectronics
- high speed via drilling for PCBs, BGAs, MCMs, and other high density devices
- dielectric material removal for flexible
circuits
- high speed marking
- cutting and scribing of ceramic
substrates
- wire stripping
- PCB repair - solder mask removal and short deletion
- circuit routing and depanelling
- capabilities include working with glass,
ceramics, polymers, and metals
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Information
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3D structure on zirconium oxide ceramics. Groove width 10 microns.
Laser drilled
micro via in FR4
(Click on any picture
to zoom in)
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Other Applications
- general marking on plastics, metals,
ceramics, and glass
- inkjet hole drilling systems and services
- CVD diamond machining
- gemstone marking
- high-precision micromachining and
drilling of refractive metals
- micromachining of wood, plywood,
plastics, cardboard, etc.
- ceramic drilling, scribing, and cutting
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Information
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Micromachining of
tungsten:
Hole diameter 1.5 mm
Laser-made threads:
Plastic rod diameter 20 mm
A 3D structure: a fifty microns through via at the bottom of a blind via 250 microns in diameter and 150 microns deep; all in 700 microns thick ceramics.
(Click on any picture
to zoom in)
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